View EXCML16A270U_4940405.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Chip Bead Cores
Chip Bead Cores
Type:
EXCCL EXCML EXC3B
Recommended Applications
Features
Effective noise suppression for power lines and high speed signal lines Easy pattern layout on PC Board Type: EXCCL, EXCML Low DC Resistance 3 to 8 m typical: Rated current (3 and 4 Amperes) (type: EXCML) Low impedance Type: EXC3B High impedance for high speed signal line noise Increased attenuation 60 -1 A, 120 -0.5 A are achieved by using 1608 size (type: EXC3BP)
Digital equipment such as PCs, word processors, printers, HDD, PCC, CD-ROMs, DVD-ROMs. Digital audio and video equipment such as VCRs, DVC, CD Players, DVD Players. AC adapters, and switching power supplies. Electronic musical instruments, and other digital equipment.
Type: EXCCL
1
Explanation of Part Numbers
2 3 4 5 6 7 8 9 10 11 12
E
X
Product Code
C
C
Type
L
Part kind
3
2
Size
1
6
U
Form
1
Suffix
Noise Filter
Chip type
Bead core
Code Dimensions (mm) 4532 3225 3216 4.5x3.2x1.8 3.2x2.5x1.6 3.2x1.6x1.6
Code U
Packing Embossed Carrier Taping
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Chip Bead Cores
Construction Dimensions in mm (not to scale)
L A L A W
Ferrite core
Electrode
L A EXCCL4532 4.50.4 3.20.3 1.80.2 0.50.2 (1812) EXCCL3225 3.20.3 2.50.3 1.60.3 0.50.3 (1210) EXCCL3216 3.20.3 1.60.3 1.60.3 0.50.3 (1206)
Type (inches)
Dimensions (mm) W H
Mass (Weight) [mg/pc.]
125.8 60.5 37
Type: EXCML
1
Explanation of Part Numbers
2 3 4 5 6 7 8 9 10 11 12
E
X
Product Code
C
M
Type
L
Part kind
2
Size
0
A
Material
3
9
0
U
Form
Nominal Impedance
Noise Filter
Molded Chip type
Bead core
Code Dimensions (mm) 45 32 20 16 4.5x1.6 x1.1 3.2x1.6 x0.9 2.0x1.25x0.9 1.6x0.8 x0.8
The first two digits are significant figure of impedance value and the third one denotes the number of zeros following
Code U H
Packing Embossed Carrier Taping (EXCML16 to 32) Embossed Carrier Taping (EXCML45)
Construction
Dimensions in mm (not to scale)
e L W
T
Ferrite core
Type (inches)
Conductor Electrode
L 1.60.2
Dimensions (mm) W T 0.80.2 0.80.2
e (0.4) (0.5) (0.6) (0.6)
Mass (Weight) [mg/pc.]
EXCML16 (0603) EXCML20 (0805) EXCML32 (1206) EXCML45 (1806)
4.5 10.5 21.5 36.0
2.00.2 1.250.20 0.90.2 3.20.3 4.50.3 1.60.3 1.60.3 0.90.2 1.10.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Chip Bead Cores
Type: EXC3B
1
Explanation of Part Numbers
2 3 4 5 6 7 8 9 10 11 12
E
X
Product Code
C
3
Size
B
B
2
2
1
H
Form Suffix
Type Characteristics
Nominal Impedance
Noise Filter
Code Dimensions (mm) 3 1.6x0.8x0.8
Multilayer Chip type Bead Core
B
P
High frequency High attenuation for signal Lines High frequency High attenuation for Power Lines
The first two digits are significant figure of impedance value and the third one denotes the number of zeros following
Code H
Packing Embossed Carrier Taping
Construction
Dimensions in mm (not to scale)
Ferrite core
e L W
T
Inner Conductor
Electrode
Type (inches) EXC3BB (0603) EXC3BP (0603)
L 1.60.2 1.60.2
Dimensions (mm) W T 0.80.2 0.80.2
e
Mass (Weight) [mg/pc.]
0.80.2 0.300.15 0.80.2 0.300.15
4.5 4.5
Ratings
Type 4532 3225 3216 4516 3216 2012 1608 Part Number EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H EXCML32A680U EXCML20A390U EXCML16A270U EXC3BP600H EXC3BP121H 1608 EXC3BB221H EXC3BB601H EXC3BB102H Impedance ( ) at 100 MHz 115 45 25 91 68 39 27 60 120 220 600 1000 25 tol.(%) Rated Current (mA DC) 2000 2000 2000 3000 3000 4000 4000 1000 500 200 100 50 DC Resistance ( ) max. 0.1 0.05 0.05 0.016 0.012 0.008 0.006 0.07 0.1 0.3 0.8 1
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
Impedance Characteristics (Reference Data)
Measured by HP4291A Z : Impedance
R : Resistance
X : Reactance
EXCCL4532U1 (4532)
140 120 100 80 60 40 20 0 1
EXCML16A270U (1608)
140 120 100 80 60 40 20 0 1 10
Z , R, X( )
Z R X
Z , R, X( )
Z
R
X 10000
10
100
1000
10000
Frequency(MHz)
100 1000 Frequency(MHz)
EXCCL3225U1 (3225)
140 120 100 80 60 40 20 0 1 10
EXCML20A390U (2012)
140 120 100 80 60 40 20 0 1 10
Z , R, X( )
Z R X 100 1000 10000 Frequency(MHz)
Z , R, X( )
Z R X 100 1000 Frequency(MHz) 10000
EXCCL3216U1 (3216)
140 120 100 80 60 40 20 0 1 10
EXCML32A680U (3216)
140 120 100 80 60 40 20 0 1 10
Z , R, X( )
Z , R, X( )
Z R X
Z R X 100 1000 10000 Frequency(MHz)
100 1000 Frequency(MHz)
10000
EXCML45A910H (4516)
180 160 140 120 100 80 60 40 20 0 1 10
Z , R, X( )
Z R X
100 1000 Frequency(MHz)
10000
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
Impedance Characteristics (Reference Data)
Measured by HP4291A Z : Impedance
R : Resistance
X : Reactance
EXC3BB221H (1608)
1400 1200 1000 800 600 400 200 0 1 10
EXC3BP121H (1608)
200 Z , R, X( ) 150 100 50 0 10000 1 10 100 1000 10000 Frequency(MHz) X Z R
Z , R, X( )
Z X 100 R 1000
Frequency(MHz)
EXC3BB601H (1608)
1400 1200 1000 800 600 400 200 0 1 10
EXC3BP600H (1608)
200 Z , R, X( ) 150 100 50 X 100 1000 10000 0 1 10 100 X 1000 10000 Z R
Z , R, X( )
R
Z
Frequency(MHz)
Frequency(MHz)
EXC3BB102H (1608)
1400 1200 1000 800 600 400 200 0 1 10
Z , R, X( )
Z R X
100
1000
10000
Frequency(MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Cores
Packaging Methods (Taping)
Standard Quantity Part Number EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H EXCML32A680U EXCML20A390U EXCML16A270U EXC3B H Taping Reel
T t1
Kind of Taping
Pitch (P1) 8 mm
Quantity 1000 pcs./reel 2000 pcs./reel
Embossed Carrier Taping
4 mm
3000 pcs./reel
4000 pcs./reel
Embossed Carrier Taping
Sprocket hole
D0 A B
Compartment
C
E
F W
D
t2 Chip component
P1
P2
P0
E
Tape running direction
A
W
Embossed Carrier Dimensions (mm) Part Number EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H EXCML32A680U EXCML20A390U EXCML16A270U EXC3B H A B W F E P1 8.00.1 P2 P0 D0 t1 t2 2.4 max. 2.1 max.
3.60.2 4.90.2 12.00.2 5.50.1 2.90.2 3.60.2 2.00.2 3.60.2 1.90.2 3.50.2 1.50.2 2.30.2 1.10.2 2.10.2 1.00.1 1.80.1 8.00.2 3.50.1 8.00.2 3.50.1
1.90.2 4.80.2 12.00.2 5.50.1 1.750.10 4.00.1 2.00.1 4.00.1 1.50.1 0.200.05 1.8 max.
1.6 max. 0.250.05
Standard Reel Dimensions (mm) Part Number EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H EXCML32A680U EXCML20A390U EXCML16A270U EXC3B H 09.5+0.5 -1.0 13 max.
0 180.0-3.0
A
B
C
D
E
W 13.0+0.5 -1.0 09.5+0.5 -1.0
T 16.5 max. 13 max. 16.5 max.
60.01.0
13.00.5
21.00.8
2.00.5
-1.0 13.0+0.5
1.20.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
B
t
t
Chip Bead Cores
Recommended Land Pattern Dimensions in mm (not to scale)
(mm)
Part Number EXCCL4532U1 EXCCL3225U1
A B
A 3 1.7 1.7 2.6 to 3 1.6 to 2 0.8 to 1.2 0.6 to 1 0.8 to 1
B 5.4 4.1 4.1 5.5 to 6.5 4 to 5 3 to 4 2 to 3 2 to 2.6
C 2.8 2.1 1.2 1.2 to 1.6 1.2 to 1.6 1 to 1.2 0.8 to 1 0.8 to 1
EXCCL3216U1 EXCML45A910H EXCML32A680U EXCML20A390U EXCML16A270U EXC3B H
C
Recommended Soldering Conditions
Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use.
Peak Temperature Preheating Heating
For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 10 C Time 60 s to 120 s 30 s to 40 s max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 C to 170 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s
Time
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder each electrode for 3 seconds or less. Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog. 1. Flow soldering may cause this product to come off because the adhesiveness of the product element is low. Please consult our sales representative in advance about flow soldering. 2. Use rosin-based flux or halogen-free flux. 3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the bead cores. Handle with care. 5. Store the bead cores in a location with a temperature ranging from -5 C to +40 C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
* When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment (except ESD Suppressors) These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). * Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. * Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 C to +40 C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 C to +40 C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight
Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English.
Jan. 2008
- EL113 -

▲Up To Search▲

Price & Availability of EXCML16A270U

	To Download EXCML16A270U Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .